Listen to this articleBelow is our recent interview with Larry Marcanti, Marketing Director at HDP User Group:
Q: You’ve recently announced free Automotive Electronics Webinar; can you tell us something more?
A: I would be happy to. Automotive Electronics is one of the fastest-growing markets for electronic packaging and design. Enhanced safety capability, Hybrid power, and Navigation are just a few of the many new developments that employ electronics. Our webinar focuses on several standards and regulatory requirements and packaging technologies unique to this market and is open to anyone interested in these areas. HDP is looking to initiate new projects that focus on Automotive requirements. Automotive power requirements and harsh use operating environment for electronics are areas important to our members.
Q: What will be the Agenda for the webinar?
A: We will have several presentations by industry experts that will cover these topics:
• Mobility Trends and Their Impact on The Automotive Supply Chain – Dr. Stefan Gutschling – ZVEI
• Power PCB requirements for Automotive Applications – Alun Morgan – Ventec Laminates
• Automotive Packaging Trends – Challenges & Solutions – Thorsten Meyer – Infineon
• The regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market. Art Creidler – U.L.
• Considerations in Automotive PCB manufacture – Raj Kumar – TTM Technologies
• Round Table & Questions – Moderated by Jan Vardaman – President, and Founder of Techsearch International recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.
The webinar will be held June 25. Please email me at Larrym@hdpug.org to register.
HDP project categories
Q: Could you provide our readers with a brief introduction to HDP User Group?
A: HDP User Group is a non-profit trade organization that offers memberships to companies involved in the supply chain of manufacturing products that utilize high-density electronic packages.
HDP is a member-driven organization. The members decide what technical areas are pursued and what issues are investigated. This structure keeps us focused on the most important issues affecting the electronics manufacturing Industry. The organization works with other industry consortia, universities, and government agencies to develop the industry awareness of its project results and to support its membership’s goals.
Q: What are main benefits for the Electronics Manufacturing industry?
A: HDP User Group was founded on the premise that by working together and sharing the risks and rewards of implementing new technology, all the members, and the industry as well, would accomplish more at a lower cost than going it alone. Over 25 years of successful operation, as well as continued growth in both membership and projects, has proven that premise to be true. A collaborative approach, leveraging the knowledge and expertise of members representing a broad spectrum of the electronics manufacturing supply chain guarantees efficiently executed projects delivering high returns on the effort invested by our participants. Members have the opportunity to benefit from gaining direct access to these experts for guidance on deployment within their own companies.
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Q: What are your plans for next 12 months?
A: HDP holds regular member meetings where they can do a face to face review of the progress of our projects. Currently, we have 25 active projects and 49 member companies participating. Project category breakdown of current projects is as follows: Emerging Technologies 12%; Component Packaging 4%; Evaluation and Analysis of Printed Wiring Board Technology 16%; Material Technology 24%; Printed Wiring Board Assembly Technology 20%; Printed Wiring Board Technology 24%.
We have three member meetings planned over the next twelve months. Our next member meeting is planned for October and will be hosted by one of our member companies. We also plan to present the outcome of a few of our projects at various industry conferences.
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